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Domestic CMOS image sensors: The Path to Breakthrough and Future Direction
Time: 2025/12/18 Views: 148

Today, Wuxi Rihuan Sensing Technology Co., Ltd. will introduce to you the domestic CMOS image sensor: the breakthrough path and Future direction.


Domestic CMOS image sensors (CIS) have evolved from followers relying on imports to a significant force in the global market. Their development process is a vivid demonstration of the self-reliance and control of China's semiconductor industry. The following elaborates from the core dimensions:


I. Global CIS Market Landscape and Technological Evolution

The market size has been growing steadily. Global revenue reached 23.2 billion US dollars in 2024 and is expected to increase to 30.1 billion US dollars by 2030, with a compound annual growth rate of 4.4%.

The landscape is characterized by a concentration of top players and the rise of China. SONY leads with a nearly 45% share, while Chinese companies such as Omnivision and Starway are growing rapidly. In 2024, Starway's revenue is expected to increase by 105.7% year-on-year.

Technology has evolved from the "pixel size race" to 3D stacking, metasurface optics and other directions. Back-illuminated (BSI), global shutter (GS) and other technologies are widely applied in various scenarios.


Ii. The Three-Stage Development Process of Domestic CIS

Early exploration (2003-2010) : Enterprises such as Goke Microelectronics were established, and they developed in coordination with SMIC to achieve mass production of low-pixel sensors and accumulate early experience.

Technological Breakthroughs (2012-2020) : Changguang Chenxin broke through core technologies, and Weir Co., Ltd. acquired Omnivision Technology. The foundation for domestic CIS to enter the high-end market was laid.

Comprehensive Rise (2020 to present) : Omnivision holds the top global market share in automotive CIS, Starlight's high-pixel sensors are installed in domestic flagship mobile phones, and Goke Microelectronics ranks second in global smartphone CIS shipments.



Iii. Core Challenges in the Process of Localization

Due to the constraints of patent barriers, international enterprises have long monopolized core technologies, and early domestic enterprises have faced high patent fees or design bypass difficulties.

The manufacturing process once relied on overseas contract manufacturers, facing issues such as capacity queues, cost fluctuations and geopolitical risks.

The breakthrough in the high-end market is insufficient, and fields such as industrial inspection and consumer-grade full-frame cameras are still dominated by international giants.

The collaboration of the industrial chain needs to be deepened. In the early stage, the upstream and downstream links were scattered, and there was a large gap between the image processing algorithms and the international level.

Iv. Key Driving Factors for the Rise of Domestic CIS

Policy guidance has been strengthened. The "Made in China 2025" initiative has set a target for the self-sufficiency rate of chips, and the Chinese Academy of Sciences' special projects and local industrial parks have provided support.

Empowered by the huge domestic demand, the market scale of consumer electronics, new energy vehicles and security equipment leads the world, forming a positive cycle of demand - research and development - iteration.

The industrial chain continues to mature. The production capacity of foundries such as SMIC and Jinghe Integration has been released, and the packaging and testing as well as material links have gradually achieved domestic production.

Through technological accumulation and breakthroughs, enterprises have made up for the shortcomings in core technologies by conducting independent research and development, external acquisitions and capital investment.


V. Comparison of Strength between Domestic and International Enterprises

Advantages of Domestic enterprises

It leads the market share in the automotive market, has a fast response speed, excellent cost control, and maintains close cooperation with domestic automakers.

The detailed performance has been broken through, with indicators such as dynamic range and low power consumption surpassing those of international products of the same period.

Cost and supply chain stability, full-process domestic production brings price advantages, and avoids overseas supply chain risks.

Localized services are highly efficient, customized R&D cycles are short, and the adaptation to customer needs is more precise.

Insufficient domestic enterprises

The fields such as high-end consumer-grade cameras and L4-level autonomous driving high-pixel sensors still lag behind.

The technical ecosystem collaboration is insufficient, and the adaptation effect between image processing algorithms and sensors needs to be improved.

The gap in adaptability to extreme environments, the working range at high and low temperatures, and the resolution of high-end medical imaging are not as good as those of international products.


Vi. Future Development Directions of Domestic CIS

Focus on core areas and make breakthroughs in 8-megapixel automotive-grade CIS for automobiles and 1-inch large sensor sensors for mobile phones.

Expand into emerging scenarios and lay out dedicated sensors in fields such as medical imaging and AR/VR.

Strengthen technological research and development, focusing on core technologies such as SPAD and ToF as well as patent layout.

Deepen industrial collaboration, strengthen cooperation with domestic contract manufacturers, and leverage the overseas expansion of new energy vehicles to expand the global market.